Invention Grant
- Patent Title: Process for preparing a polymeric relief structure
- Patent Title (中): 制备聚合物浮雕结构的方法
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Application No.: US11883559Application Date: 2006-02-09
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Publication No.: US08927178B2Publication Date: 2015-01-06
- Inventor: Cees C. Bastiaansen , Dirk Jan Broer , Carlos C. Sanchez
- Applicant: Cees C. Bastiaansen , Dirk Jan Broer , Carlos C. Sanchez
- Applicant Address: NL Eindhoven
- Assignee: Stichting Dutch Polymer Institute
- Current Assignee: Stichting Dutch Polymer Institute
- Current Assignee Address: NL Eindhoven
- Agency: Nixon & Vanderhye P.C.
- Priority: WOPCT/NL2005/000106 20050209
- International Application: PCT/NL2006/000067 WO 20060209
- International Announcement: WO2006/085757 WO 20060817
- Main IPC: G03F7/36
- IPC: G03F7/36 ; G03F7/38 ; G03F7/00 ; G03F7/095 ; G03F7/038

Abstract:
The present invention relates to a process for the preparation of a polymeric relief structure by a) coating a substrate with a first coating composition comprising one or more radiation-sensitive ingredients, d) locally treating the coated substrate with electromagnetic radiation having a periodic or random radiation-intensity pattern, forming a latent image, e) polymerizing and/or crosslinking the resulting coated substrate to a first coating. This process is improved by applying a second coating composition on top of the first coating composition, said second coating composition comprising either an organic compound (Co) of a monomeric nature and wherein Co is also polymerized during the process, or wherein said second coating comprises a dissolved polymer (Cp). As a result a polymeric relief structure is obtained, where a substrate is coated with a functional, stacked, bi-layer, in which each layer exhibits a specific, and from each other differing function.
Public/Granted literature
- US20080131626A1 Process for Preparing a Polymeric Relief Structure Public/Granted day:2008-06-05
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