A system for analyzing electronic devices includes an input station, a transport apparatus, an electric machine interface station, an electric machine interface, a support structure and first and second thermal components. The input station receives a plurality of electronic devices and the transport apparatus transports each of the electronic devices from the input station to the electric machine interface station. The electric machine interface engages the electronic device when the electronic device is at the electric machine interface station, and is disengageable from the electronic device for the electronic device to be transportable by the transport apparatus away from the electric machine interface station. The first and second thermal components are located on opposing sides of the electronic device when the electronic device is at the electric machine interface station to simultaneously transfer heat to or from the electronic device.