公开(公告)号：US06241532B1

公开(公告)日：2001-06-05

申请号：US09344644

申请日：1999-06-25

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: H01R909

CPC classification number: H01R12/52 ,  H01R12/7082 ,  H01R12/714 ,  H05K3/365

Abstract: A high density electrical connector assembly comprising first and second sheet-like bodies. The first sheet-like body is made from an insulating material and has a surface and a plurality of electrical traces extending to a plurality of first interconnect pads disposed on the surface in a first pattern. The second sheet-like body is also made from an insulating material and has a surface and a plurality of second electrical traces extending to a plurality of second interconnect pads disposed on the surface of the second sheet-like body in a second pattern. The second pattern is substantially a mirror image of the first pattern. The surface of the first sheetlike body faces the surface of the second sheet-like body so that the first interconnect pads face the second interconnect pads. A flexible sheet of an insulating and compliant material is disposed between the first and second interconnect pads and has first and second opposite surfaces. A plurality of first connector pads is disposed on the first surface in the first pattern and a plurality of second connector pads is disposed on the second surface in the second pattern and electrically connected through the flexible sheet to the first connector pads. A Clamping assembly is mountable to the first and second sheet-like bodies for urging the first and second sheet-like bodies and the flexible sheet together so that the first interconnect pads register with and engage the first connector pads and the second interconnect pads register with and engage the second connector pads. The compliant material of the flexible sheet facilitates electrical connections between the first interconnect pads and the first connector pads and between the second interconnect pads and the second connector pads for making electrical connections between the first and second interconnect pads.

Abstract translation: 一种高密度电连接器组件，包括第一和第二片状体。 第一片状体由绝缘材料制成并且具有延伸到以第一图案设置在表面上的多个第一互连焊盘的表面和多个电迹线。 第二片状体也由绝缘材料制成，并且具有表面和多个第二电迹线，以第二图案延伸到布置在第二片状体的表面上的多个第二互连焊盘。 第二图案基本上是第一图案的镜像。 第一片状体的表面面向第二片状体的表面，使得第一互连焊盘面对第二互连焊盘。 绝缘和顺应性材料的柔性片设置在第一和第二互连焊盘之间并且具有第一和第二相对表面。 多个第一连接器焊盘设置在第一图案的第一表面上，并且多个第二连接器焊盘设置在第二图案的第二表面上并且通过柔性片电连接到第一连接器焊盘。 夹紧组件可安装到第一和第二片状体上，用于将第一和第二片状物体和柔性片材推到一起，使得第一互连焊盘与第一连接器焊盘配准并接合，并且第二互连焊盘与 并接合第二连接器垫。 柔性片的柔性材料有助于第一互连焊盘和第一连接器焊盘之间以及第二互连焊盘和第二连接器焊盘之间的电连接，用于在第一和第二互连焊盘之间进行电连接。

公开(公告)号：US08928342B2

公开(公告)日：2015-01-06

申请号：US13628604

申请日：2012-09-27

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: G01R31/00 ,  G01R31/20

CPC classification number: G01R31/2867 ,  G01R31/2874 ,  G01R31/2893

Abstract: A system for analyzing electronic devices includes an input station, a transport apparatus, an electric machine interface station, an electric machine interface, a support structure and first and second thermal components. The input station receives a plurality of electronic devices and the transport apparatus transports each of the electronic devices from the input station to the electric machine interface station. The electric machine interface engages the electronic device when the electronic device is at the electric machine interface station, and is disengageable from the electronic device for the electronic device to be transportable by the transport apparatus away from the electric machine interface station. The first and second thermal components are located on opposing sides of the electronic device when the electronic device is at the electric machine interface station to simultaneously transfer heat to or from the electronic device.

Abstract translation: 用于分析电子设备的系统包括输入站，传送设备，电机接口站，电机接口，支撑结构以及第一和第二热分量。 输入站接收多个电子设备，并且传送设备将每个电子设备从输入站传送到电机接口站。 当电子设备在电机接口站时，电机接口与电子设备接合，并且能够从用于电子设备的电子设备脱离可由运送设备运送的远离电机接口站的电子设备。 当电子设备在电机接口站处时，第一和第二热部件位于电子设备的相对侧上，以同时将热量传送到电子设备或从电子设备传送热量。

公开(公告)号：US20140088909A1

公开(公告)日：2014-03-27

申请号：US13628594

申请日：2012-09-27

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: G06F19/00 ,  G01R1/04

CPC classification number: G01R31/2867 ,  G01R31/2874 ,  G01R31/2893

Abstract: The invention provides a method of determining a parameter of a measured electronic device for purposes of programming the device or determining its functionality. A stored reference profile of a reference electronic device includes a respective frequency at each of a plurality of respective temperatures. Heat is simultaneously transferring heat to or from the reference and measured electronic devices while recording a frequency provided by the reference electronic device and a corresponding frequency provided by the measured electronic device at each of a plurality of instances in time. A temperature of the reference electronic device is determined based on the frequency detected for the reference electronic device and the corresponding temperature within the reference profile. The frequency detected from the measured electronic device is then correlated with a temperature the reference electronic device used as the temperature of the measured electronic device.

Abstract translation: 本发明提供了一种确定所测量的电子设备的参数以便编程设备或确定其功能的方法。 参考电子设备的存储的参考轮廓包括在多个相应温度中的每一个处的相应频率。 在同时记录由参考电子设备提供的频率以及由多个实例中的测量电子设备提供的对应频率的同时，热量同时将热量传送到参考和测量的电子设备。 参考电子设备的温度基于对于参考电子设备检测的频率和参考分布内的对应温度来确定。 然后将从测量的电子设备检测的频率与作为测量的电子设备的温度的参考电子设备的温度相关。

公开(公告)号：US5596282A

公开(公告)日：1997-01-21

申请号：US502590

申请日：1995-07-14

Applicant: James N. Giddings ,  Robert P. Howell

Inventor： James N. Giddings ,  Robert P. Howell

IPC: G01R1/04 ,  G01R31/02

CPC classification number: G01R1/0433

Abstract: The present invention relates to the field of programming, testing, or burn-in integrated circuits. A testing device is disclosed whereby contact with the leads of an integrated circuit is made while the integrated circuit is in the shipping tray. Contact is made from a jig which is lowered onto the integrated circuit and makes contact at the shoulder of the leads of the integrated circuit, thereby contacting the integrated circuit at the strongest point of the lead and insuring good contact to the desired lead. The testing mechanism may include one jig or more jigs up to one jig for each integrated circuit in an integrated circuit storage tray. The invention allows for the testing of integrated circuits with a minimum of physical movement and manipulation of the integrated circuits.

Abstract translation: 本发明涉及编程，测试或老化集成电路领域。 公开了一种测试装置，其中当集成电路在运输托盘中时与集成电路的引线接触。 触点由下降到集成电路上的夹具制成，并与集成电路引线的肩部接触，从而使集成电路在引线的最强点接触，并确保与所需导线的良好接触。 测试机构可以包括在集成电路存储托盘中的每个集成电路的一个夹具或多于一个夹具的夹具。 本发明允许以最小的集成电路的物理移动和操纵来测试集成电路。

公开(公告)号：US08466705B1

公开(公告)日：2013-06-18

申请号：US13680390

申请日：2012-11-19

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: G01R31/20 ,  G01R31/00

CPC classification number: G01R1/0408 ,  G01R1/0458 ,  G01R31/2642

Abstract: A system for analyzing electronic devices includes a first cab, an input station, a transport apparatus, an electric machine interface station, and an electric machine interface. The first cab includes a holder having formations for removably receiving a first subset of electronic devices and a communications interface. The input station receives the first cab and the transport apparatus transports the first cab with the first subset of electronic devices from the input station to the electric machine interface station. The electric machine interface is positioned to engage communicatively with the communications interface of the first cab when the first cab is at the electric machine interface station, and is disengageable from the communications interface of the first cab for the first cab to be transportable by the transport apparatus away from the electric machine interface station. Heat conducts to or from the electronic devices while they are being analyzed.

Abstract translation: 一种用于分析电子设备的系统包括第一驾驶室，输入站，运输设备，电机接口站和电机接口。 第一驾驶室包括具有用于可移除地接收电子设备的第一子集和通信接口的结构的保持器。 输入站接收第一驾驶室，运输装置将具有电子设备的第一子集的第一驾驶室从输入站传送到电机接口站。 当第一驾驶室处于电机接口站时，电机接口被定位成与第一驾驶室的通信接口通信地接合，并且能够与用于第一驾驶室的第一驾驶室的通信接口脱离接合，以便通过运输 远离电机接口站的设备。 在对电子设备进行分析时，热量进入或离开电子设备。

公开(公告)号：US07005602B1

公开(公告)日：2006-02-28

申请号：US10788560

申请日：2004-02-27

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: B23K26/00

CPC classification number: B23K26/04 ,  B23K26/082 ,  B23K2101/007

Abstract: A method of marking an article is described. A laser beam is generated. A position of a focal point of the laser beam is detected with a CCD detector that is in a predetermined position relative to a frame. The detector is then moved out of a plane of the focal point. An article is then held by a holder that is in a predetermined position relative to the frame, so that a marking surface of the article is in the plane. The laser beam is then directed onto the marking surface of the article, and the focal point is moved relatively across the marking surface. The position of the focal point on the marking surface is based on both the data set and reference position. The reference position may, for example, be deducted from factory calibration data to obtain modified calibration data, and the modified calibration data may be used to control the laser beam.

Abstract translation: 描述标记物品的方法。 产生激光束。 利用相对于一帧的预定位置的CCD检测器检测激光束焦点的位置。 然后将检测器移出焦点的平面。 然后，通过相对于框架处于预定位置的保持器来保持制品，使得制品的标记表面在平面中。 激光束然后被引导到物品的标记表面上，并且焦点相对于标记表面移动。 焦点在标记面上的位置基于数据集和参考位置。 参考位置可以例如从工厂校准数据中扣除以获得修改的校准数据，并且修改的校准数据可用于控制激光束。

公开(公告)号：US06925709B1

公开(公告)日：2005-08-09

申请号：US10310509

申请日：2002-12-04

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: H05K3/30 ,  H05K13/04

CPC classification number: H05K13/0417 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53261

Abstract: An apparatus for assembling electronics is provided, comprising a support frame, at least one pick-and-place mechanism, at least one device-engaging component, a feed device, and a programmer or tester. The pick-and-place mechanism is secured to the support frame. The device-engaging component is secured to the pick-and-place mechanism. The feed device has a slender body secured to the frame to feed a plurality of electronic devices to a feed location. The programmer or tester has a slender body secured to the support frame in a side-by-side relationship relative to the feed device. The programmer or tester has a socket located at an intermediate location. The devices are movable by the device-engaging component from the feed location to the socket at the intermediate location.

Abstract translation: 提供了一种用于组装电子设备的装置，包括支撑框架，至少一个拾取和放置机构，至少一个装置接合部件，进给装置和编程器或测试器。 拾取和放置机构固定在支撑架上。 装置接合部件被固定到拾取和放置机构。 进给装置具有固定到框架的细长主体以将多个电子装置馈送到进给位置。 编程器或测试器具有相对于馈送装置并排地固定到支撑框架的细长主体。 编程器或测试仪具有位于中间位置的插座。 这些装置可以通过装置接合部件从进给位置移动到中间位置处的插座。

公开(公告)号：US20140084952A1

公开(公告)日：2014-03-27

申请号：US13628604

申请日：2012-09-27

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: G01R31/02

CPC classification number: G01R31/2867 ,  G01R31/2874 ,  G01R31/2893

Abstract: A system for analyzing electronic devices includes an input station, a transport apparatus, an electric machine interface station, an electric machine interface, a support structure and first and second thermal components. The input station receives a plurality of electronic devices and the transport apparatus transports each of the electronic devices from the input station to the electric machine interface station. The electric machine interface engages the electronic device when the electronic device is at the electric machine interface station, and is disengageable from the electronic device for the electronic device to be transportable by the transport apparatus away from the electric machine interface station. The first and second thermal components are located on opposing sides of the electronic device when the electronic device is at the electric machine interface station to simultaneously transfer heat to or from the electronic device.

Abstract translation: 用于分析电子设备的系统包括输入站，传送设备，电机接口站，电机接口，支撑结构以及第一和第二热分量。 输入站接收多个电子设备，并且传送设备将每个电子设备从输入站传送到电机接口站。 当电子设备在电机接口站时，电机接口与电子设备接合，并且能够从用于电子设备的电子设备脱离可由运送设备运送的远离电机接口站的电子设备。 当电子设备在电机接口站处时，第一和第二热部件位于电子设备的相对侧上，以同时将热量传送到电子设备或从电子设备传送热量。

公开(公告)号：US07914296B1

公开(公告)日：2011-03-29

申请号：US12652685

申请日：2010-01-05

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: H01R12/00

CPC classification number: H01R12/62 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/07378 ,  H01L24/72 ,  H01L2924/01033 ,  H01L2924/14 ,  H05K3/4092 ,  H05K2201/0221 ,  H05K2201/0373 ,  H05K2201/10378 ,  H05K2203/068

Abstract: The invention provides an interconnecting assembly including a main structure having first and second portions, an inner terminal on the main structure, a support film having first and second portions, an inner contact and outer terminal formed on opposing sides of the support film, a conductive lever portion on the support film and connecting the inner contact and outer terminal, wherein the inner contact contacts the inner terminal and the first portions are moved relatively towards one another so that the second portion of the film is pivoted together with the conductive lever portion and the outer terminal away from the second portion of the main structure, the outer terminal being depressible towards the main structure from a first position to a second position and returning to the first position when a force depressing the outer terminal is removed.

Abstract translation: 本发明提供了一种互连组件，其包括具有第一和第二部分的主结构，主结构上的内部端子，具有第一和第二部分的支撑膜，形成在支撑膜的相对侧上的内部触点和外部端子，导电 杠杆部分在支撑膜上并且连接内接触件和外端子，其中内触头接触内端子，并且第一部分相对于彼此移动，使得膜的第二部分与导电杆部分一起枢转，并且 所述外端子远离所述主结构的第二部分，所述外端子从所述第一位置向第二位置朝向所述主结构压下，并且当去除所述外端子的力时返回到所述第一位置。

公开(公告)号：US07290332B1

公开(公告)日：2007-11-06

申请号：US10931371

申请日：2004-08-31

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: H01K3/10

CPC classification number: H05K3/326 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H01R12/52 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/0307 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: According to one aspect of the present invention, a method of constructing an interposer is provided. A conductive layer is formed on a nonconductive layer. The conductive layer has via portions, non-via portions, and first and second opposing surfaces. The first surface of the conductive layer is adjacent to the nonconductive layer. Portions of the nonconductive layer are removed to expose portions of the first surface of the conductive layer. Conductive pads are formed on the exposed portions of the first surface and the second surface of the conductive layer. The non-via portions of the conductive layer are removed to form a plurality of electrically separated conductors. Each conductor includes at least two conductive pads and a via portion of the conductive layer.

Abstract translation: 根据本发明的一个方面，提供了一种构造插入件的方法。 在非导电层上形成导电层。 导电层具有通孔部分，非通孔部分以及第一和第二相对表面。 导电层的第一表面与非导电层相邻。 去除非导电层的部分以暴露导电层的第一表面的部分。 导电垫形成在导电层的第一表面和第二表面的暴露部分上。 去除导电层的非通孔部分以形成多个电分离的导体。 每个导体包括至少两个导电焊盘和导电层的通孔部分。