Invention Grant
- Patent Title: Current lead with a configuration to reduce heat load transfer in an alternating electrical current environment
- Patent Title (中): 电流引线，配置为减少交流电流环境中的热负荷传递
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Application No.: US13273927Application Date: 2011-10-14
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Publication No.: US08933335B2Publication Date: 2015-01-13
- Inventor: Gregory Citver , Frank Sinclair , D. Jeffrey Lischer , Nandishkumar Desai
- Applicant: Gregory Citver , Frank Sinclair , D. Jeffrey Lischer , Nandishkumar Desai
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: H01B5/00
- IPC: H01B5/00 ; H01F6/06
Abstract:
A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead.
Public/Granted literature
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