Invention Grant
- Patent Title: Low frequency response microphone diaphragm structures and methods for producing the same
- Patent Title (中): 低频响应麦克风隔膜结构及其制造方法
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Application No.: US13795861Application Date: 2013-03-12
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Publication No.: US08946831B2Publication Date: 2015-02-03
- Inventor: Fang Liu , Kuang L. Yang
- Applicant: Invensense, Inc.
- Applicant Address: US CA San Jose
- Assignee: Invensense, Inc.
- Current Assignee: Invensense, Inc.
- Current Assignee Address: US CA San Jose
- Agency: IPxLaw Group LLP
- Agent Maryam Imam
- Main IPC: H04R1/00
- IPC: H04R1/00 ; B81B3/00 ; B81C1/00
Abstract:
A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic signal. In some embodiments, the sealing layer may include an equalization aperture to allow pressure to equalize on both sides of the diaphragm.
Public/Granted literature
- US20140264650A1 Low Frequency Response Microphone Diaphragm Structures And Methods For Producing The Same Public/Granted day:2014-09-18
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