Invention Grant
- Patent Title: Package for high-power semiconductor devices
- Patent Title (中): 大功率半导体器件封装
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Application No.: US13769729Application Date: 2013-02-18
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Publication No.: US08946894B2Publication Date: 2015-02-03
- Inventor: Tarak A. Railkar , Deep C. Dumka
- Applicant: TriQuint Semiconductor, Inc.
- Applicant Address: US OR Hillsboro
- Assignee: TriQuint Semiconductor, Inc.
- Current Assignee: TriQuint Semiconductor, Inc.
- Current Assignee Address: US OR Hillsboro
- Agency: Schwabe Williamson & Wyatt
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/34 ; H01L21/78
Abstract:
Methods and apparatuses for forming a package for high-power semiconductor devices are disclosed herein. A package may include a plurality of distinct thermal spreader layers disposed between a die and a metal carrier. Other embodiments are described and claimed.
Public/Granted literature
- US20140231815A1 PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES Public/Granted day:2014-08-21
Information query
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