Invention Grant
- Patent Title: Light emitting device and fabricating method thereof
- Patent Title (中): 发光元件及其制造方法
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Application No.: US13730787Application Date: 2012-12-28
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Publication No.: US08946987B2Publication Date: 2015-02-03
- Inventor: Chia-Fen Hsieh , Chien-Chun Lu , Ya-Hui Chiang , Chen-Peng Hsu , Hung-Lieh Hu
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Rabin & Berdo, P.C.
- Priority: TW96142117A 20071107
- Main IPC: H01J1/62
- IPC: H01J1/62 ; H01J63/04 ; H01L33/50 ; H05B33/10 ; H01L33/60

Abstract:
A light emitting device and a fabricating method thereof are described, wherein the light emitting device includes a substrate, a wall, a first LED chip and a light conversion filling. The first LED chip is disposed on a surface of the substrate. The wall is disposed on the surface of the substrate, and surrounds the first LED chip. A first angle between a central axis of the wall and an inner surface of the wall is 0 degree or is acute, a second angle between the central axis of the wall and an outer surface of the wall is 0 degree or is acute, and the outer surface of the wall and the substrate has a space therebetween. The light conversion filling is surrounded by the light conversion wall, and is disposed on the first LED chip.
Public/Granted literature
- US20130126918A1 LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF Public/Granted day:2013-05-23
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