Invention Grant
- Patent Title: System and method for optimizing a cut location
- Patent Title (中): 优化切割位置的系统和方法
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Application No.: US13722477Application Date: 2012-12-20
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Publication No.: US08948981B2Publication Date: 2015-02-03
- Inventor: Mo Wei , Michael Taylor , Thandava K. Edara , Timothy Felty , Matthew Tinker
- Applicant: Caterpillar Inc.
- Applicant Address: US IL Peoria
- Assignee: Caterpillar Inc.
- Current Assignee: Caterpillar Inc.
- Current Assignee Address: US IL Peoria
- Agency: Leydig, Voit & Mayer, Ltd.
- Main IPC: G06F7/00
- IPC: G06F7/00 ; H04B7/00 ; B60P1/00 ; E02F3/84 ; E02F9/20

Abstract:
A system for determining a cut location at a work surface includes a position sensor and a controller. The controller stores a final design plane of the work surface and determines an actual profile of the work surface. A plurality of target profiles extending along a path are determined, each corresponding to a cut location. The target profiles are based at least in part upon the cut location, a loading profile, slot parameters, and the actual profile of the work surface. The controller is further configured to determine a lowest cost target profile and the lowest cost target profile defines an optimized cut location. A method is also provided.
Public/Granted literature
- US20140174770A1 System and Method for Optimizing a Cut Location Public/Granted day:2014-06-26
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