Invention Grant
- Patent Title: Tape attaching device and tape attaching method
- Patent Title (中): 胶带附着装置和胶带附着方法
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Application No.: US13702139Application Date: 2011-06-10
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Publication No.: US08951379B2Publication Date: 2015-02-10
- Inventor: Shingo Yamada
- Applicant: Shingo Yamada
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2010-137951 20100617
- International Application: PCT/JP2011/003295 WO 20110610
- International Announcement: WO2011/158476 WO 20111222
- Main IPC: B32B37/00
- IPC: B32B37/00 ; H05K13/04 ; B29C63/02 ; H01L23/00 ; H05K3/32 ; H01R4/04

Abstract:
In the tape attaching method of cutting a tape member into conductive tape pieces and attaching the conductive tape pieces onto a plurality of attachment regions which are formed at a side edge part of a board, an attaching step in which the conductive tape pieces is attached onto the attachment region of a first press position, and a moving step, in which by driving a tape sending mechanism to perform the operation of sending the tape member while a press bonding head and a peeling unit are integrally moved relative to the board, the press bonding head is aligned with the attachment region of a second press position, and a separator is peeled from the tape member attached onto the first press position by the peeling unit during the relative movement, are repeated.
Public/Granted literature
- US20130075012A1 TAPE ATTACHING DEVICE AND TAPE ATTACHING METHOD Public/Granted day:2013-03-28
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