Invention Grant
- Patent Title: Semiconductor chip package and method
- Patent Title (中): 半导体芯片封装及方法
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Application No.: US13221607Application Date: 2011-08-30
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Publication No.: US08969985B2Publication Date: 2015-03-03
- Inventor: Volker Strutz , Stefan Landau , Udo Ausserlechner
- Applicant: Volker Strutz , Stefan Landau , Udo Ausserlechner
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L23/04 ; H01L23/48 ; H01L25/16 ; H01L43/04 ; G01R33/07 ; G01R33/00 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor chip package and a method to manufacture a semiconductor chip package are disclosed. An embodiment of the present invention comprises a substrate and a semiconductor chip disposed on the substrate and laterally surrounded by a packaging material. The package further comprises a current rail adjacent the semiconductor chip, the current rail isolated from the semiconductor chip by an isolation layer, a first external pad, and a via contact contacting the current rail with the first external pad.
Public/Granted literature
- US20130049746A1 Semiconductor Chip Package and Method Public/Granted day:2013-02-28
Information query
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