Invention Grant
- Patent Title: Method for fabrication of ceramic dielectric films on copper foils
- Patent Title (中): 铜箔上陶瓷电介质膜的制造方法
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Application No.: US12786940Application Date: 2010-05-25
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Publication No.: US08974856B2Publication Date: 2015-03-10
- Inventor: Beihai Ma , Manoj Narayanan , Stephen E. Dorris , Uthamalingam Balachandran
- Applicant: Beihai Ma , Manoj Narayanan , Stephen E. Dorris , Uthamalingam Balachandran
- Applicant Address: US IL Chicago
- Assignee: UChicago Argonne, LLC
- Current Assignee: UChicago Argonne, LLC
- Current Assignee Address: US IL Chicago
- Agency: Olson & Cepuritis, Ltd.
- Main IPC: B05D7/00
- IPC: B05D7/00 ; C23C26/00 ; C04B35/491 ; C04B35/624 ; C23C18/12 ; H01G4/12

Abstract:
The present invention provides a method for fabricating a ceramic film on a copper foil. The method comprises applying a layer of a sol-gel composition onto a copper foil. The sol-gel composition comprises a precursor of a ceramic material suspended in 2-methoxyethanol. The layer of sol-gel is then dried at a temperature up to about 250° C. The dried layer is then pyrolyzed at a temperature in the range of about 300 to about 450° C. to form a ceramic film from the ceramic precursor. The ceramic film is then crystallized at a temperature in the range of about 600 to about 750° C. The drying, pyrolyzing and crystallizing are performed under a flowing stream of an inert gas. In some embodiments an additional layer of the sol-gel composition is applied onto the ceramic film and the drying, pyrolyzing and crystallizing steps are repeated for the additional layer to build up a thicker ceramic layer on the copper foil. The process can be repeated one or more times if desired.
Public/Granted literature
- US20100302706A1 METHOD FOR FABRICATION OF CERAMIC DIELECTRIC FILMS ON COPPER FOILS Public/Granted day:2010-12-02
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