Invention Grant
- Patent Title: Radio frequency interconnect circuits and techniques
- Patent Title (中): 射频互连电路和技术
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Application No.: US12694450Application Date: 2010-01-27
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Publication No.: US08981869B2Publication Date: 2015-03-17
- Inventor: Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
- Applicant: Angelo M. Puzella , Joseph M. Crowder , Patricia S. Dupuis , Michael C. Fallica , John B. Francis , Joseph A. Licciardello
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H01Q21/00 ; H05K1/02 ; H05K1/11 ; H05K3/42 ; H05K3/46
Abstract:
A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.
Public/Granted literature
- US20100126010A1 Radio Frequency Interconnect Circuits and Techniques Public/Granted day:2010-05-27
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