Invention Grant
- Patent Title: Test contact arrangement
- Patent Title (中): 测试接触排列
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Application No.: US12933764Application Date: 2009-03-27
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Publication No.: US08988094B2Publication Date: 2015-03-24
- Inventor: Ghassem Azdasht
- Applicant: Ghassem Azdasht
- Applicant Address: DE Nauen
- Assignee: Pac Tech-Packaging Technologies GmbH
- Current Assignee: Pac Tech-Packaging Technologies GmbH
- Current Assignee Address: DE Nauen
- Agency: Quarles & Brady LLP
- Priority: DE102008016247 20080327
- International Application: PCT/DE2009/000393 WO 20090327
- International Announcement: WO2009/117992 WO 20091001
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R1/073 ; G01R1/067

Abstract:
The invention relates to a test contact arrangement (15) for testing semiconductor components, comprising at least one test contact (10) which is arranged in a test contact frame (13) and is designed in the type of a cantilever arm and which has a fastening base (12) and a contact arm (30) which is provided with a contact tip (11) and which is connected to the fastening base, wherein the fastening base is inserted with a fastening projection (16) thereof into a frame opening (14) of the test contact frame in such a manner that a lower edge (17) of the fastening projection is essentially aligned flush with a lower side (18) of the test contact frame.
Public/Granted literature
- US20110089963A1 TEST CONTACT ARRANGEMENT Public/Granted day:2011-04-21
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