Invention Grant
- Patent Title: Retaining ring with selected stiffness and thickness
- Patent Title (中): 固定环具有选定的刚度和厚度
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Application No.: US13661603Application Date: 2012-10-26
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Publication No.: US08998676B2Publication Date: 2015-04-07
- Inventor: Hung Chih Chen , Samuel Chu-Chiang Hsu , Gautam Shashank Dandavate
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B7/22
- IPC: B24B7/22 ; B24B37/32 ; B24B7/00
Abstract:
A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.
Public/Granted literature
- US20140120803A1 RETAINING RING WITH SELECTED STIFFNESS AND THICKNESS Public/Granted day:2014-05-01
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