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    Inner retaining ring and outer retaining ring for carrier head
    2.
    发明授权
    Inner retaining ring and outer retaining ring for carrier head 有权

    公开(公告)号：US11173579B2

    公开(公告)日：2021-11-16

    申请号：US16017689

    申请日：2018-06-25

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chih Chen ,  Mario David Silvetti ,  Yin Yuan ,  Samuel Chu-Chiang Hsu ,  Huanbo Zhang ,  Gautam Shashank Dandavate

    IPC: B24B41/06 ,  B24B37/32

    Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

    POLISHING PAD HAVING ARC-SHAPED CONFIGURATION
    3.
    发明申请
    POLISHING PAD HAVING ARC-SHAPED CONFIGURATION 审中-公开

    公开(公告)号：US20190047110A1

    公开(公告)日：2019-02-14

    申请号：US16162320

    申请日：2018-10-16

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chih Chen

    IPC: B24B37/10 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/768 ,  H01L21/321 ,  B24B37/30 ,  B24B37/11 ,  B24B37/26

    Abstract: Chemical mechanical polishing can be used for “touch-up polishing” in which polishing is performed on a limited area of the front surface of the substrate. The contact area between the polishing pad and the substrate can be substantially smaller than the radius surface of the substrate. During polishing, the polishing pad can undergo an orbital motion. The polishing pad can be maintained in a fixed angular orientation during the orbital motion. The contact area can be arc-shaped. The contact area can be provided by one or more lower portions projecting downward from an upper portion of the polishing pad. A perimeter portion of the polishing pad can be vertically fixed to an annular member and a remainder of the polishing pad within the perimeter portion can be vertically free.

    Polishing pad configuration and polishing pad support
    4.
    发明授权
    Polishing pad configuration and polishing pad support 有权

    公开(公告)号：US10105812B2

    公开(公告)日：2018-10-23

    申请号：US14801630

    申请日：2015-07-16

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chih Chen

    IPC: B24B37/10 ,  B24B37/26 ,  H01L21/67 ,  H01L21/321 ,  H01L21/768 ,  B24B37/11 ,  B24B37/30 ,  H01L21/3105 ,  H01L21/306

    Abstract: Chemical mechanical polishing can be used for “touch-up polishing” in which polishing is performed on a limited area of the front surface of the substrate. The contact area between the polishing pad and the substrate can be substantially smaller than the radius surface of the substrate. During polishing, the polishing pad can undergo an orbital motion. The polishing pad can be maintained in a fixed angular orientation during the orbital motion. The contact area can be arc-shaped. The contact area can be provided by one or more lower portions projecting downward from an upper portion of the polishing pad. A perimeter portion of the polishing pad can be vertically fixed to an annular member and a remainder of the polishing pad within the perimeter portion can be vertically free.

    Inner retaining ring and outer retaining ring for carrier head
    5.
    发明授权
    Inner retaining ring and outer retaining ring for carrier head 有权

    公开(公告)号：US10022837B2

    公开(公告)日：2018-07-17

    申请号：US14958814

    申请日：2015-12-03

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chih Chen ,  Yin Yuan ,  Samuel Chu-Chiang Hsu ,  Huanbo Zhang ,  Gautam Shashank Dandavate

    IPC: B24B37/32 ,  B24B41/06

    Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

    RETAINING RING WITH SELECTED STIFFNESS AND THICKNESS
    8.
    发明申请
    RETAINING RING WITH SELECTED STIFFNESS AND THICKNESS 有权
    具有选择的刚度和厚度的保持环

    公开(公告)号：US20150209930A1

    公开(公告)日：2015-07-30

    申请号：US14679817

    申请日：2015-04-06

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chih Chen ,  Samuel Chu-Chiang Hsu ,  Gautam Shashank Dandavate

    IPC: B24B37/32

    CPC classification number: B24B37/32 ,  B24B7/00 ,  B24B7/228

    Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

    Abstract translation: 在化学机械抛光期间用于将基板保持在载体头下方的保持环包括环形下部和固定到下部的环形上部。 环形下部具有主体，其具有用于在抛光期间接触抛光垫的底表面，并且是第一材料。 上部的上表面构造成固定到承载头。 上部是比第一材料更刚性的第二材料。 选择下部的厚度和刚度用于特定的抛光环境以改善靠近基底边缘的抛光均匀性。

    Retaining ring monitoring and control of pressure
    9.
    发明授权
    Retaining ring monitoring and control of pressure 有权
    保持环监控和压力控制

    公开(公告)号：US09017138B2

    公开(公告)日：2015-04-28

    申请号：US13749554

    申请日：2013-01-24

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chih Chen ,  Thomas H. Osterheld ,  Charles C. Garretson ,  Jason Garcheung Fung

    IPC: B24B49/02 ,  B24B37/005 ,  B24B37/32 ,  B24B37/34

    CPC classification number: B24B37/005 ,  B24B37/32 ,  B24B37/345

    Abstract: A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.

    Abstract translation: 用于在处理系统中传送衬底的装载杯装置包括具有衬底支撑件，致动器和控制器的基座组件。 致动器构造成将基座组件移动到与承载头的保持环接触的装载位置，并且基于由基座组件行进的距离产生保持环厚度信号。 控制器被配置为从致动器接收保持环厚度信号。

    Retaining ring with selected stiffness and thickness
    10.
    发明授权
    Retaining ring with selected stiffness and thickness 有权
    固定环具有选定的刚度和厚度

    公开(公告)号：US08998676B2

    公开(公告)日：2015-04-07

    申请号：US13661603

    申请日：2012-10-26

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chih Chen ,  Samuel Chu-Chiang Hsu ,  Gautam Shashank Dandavate

    IPC: B24B7/22 ,  B24B37/32 ,  B24B7/00

    CPC classification number: B24B37/32 ,  B24B7/00 ,  B24B7/228

    Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

    Abstract translation: 在化学机械抛光期间用于将基板保持在载体头下方的保持环包括环形下部和固定到下部的环形上部。 环形下部具有主体，其具有用于在抛光期间接触抛光垫的底表面，并且是第一材料。 上部的上表面构造成固定到承载头。 上部是比第一材料更刚性的第二材料。 选择下部的厚度和刚度用于特定的抛光环境以改善靠近基底边缘的抛光均匀性。

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