Invention Grant
- Patent Title: Direct overmolding
- Patent Title (中): 直接包覆成型
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Application No.: US13260736Application Date: 2010-02-24
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Publication No.: US08999433B2Publication Date: 2015-04-07
- Inventor: Christian Beisele , Josef Grindling , Daniel Baer
- Applicant: Christian Beisele , Josef Grindling , Daniel Baer
- Applicant Address: US TX The Woodlands
- Assignee: Huntsman International LLC
- Current Assignee: Huntsman International LLC
- Current Assignee Address: US TX The Woodlands
- Priority: EP09157142 20090402
- International Application: PCT/EP2010/052317 WO 20100224
- International Announcement: WO2010/112272 WO 20101007
- Main IPC: B05D3/02
- IPC: B05D3/02 ; C08L63/00 ; C08K3/34 ; C08K3/36 ; H01B3/40 ; H01H33/662
Abstract:
Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.
Public/Granted literature
- US20120022184A1 Direct Overmolding Public/Granted day:2012-01-26
Information query
