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US09000483B2 Semiconductor device with fin structure and fabrication method thereof 有权
具有翅片结构的半导体器件及其制造方法

Semiconductor device with fin structure and fabrication method thereof
Abstract:
A semiconductor device includes a substrate, a first fin structure, an electrical contact structure and a gate structure. The first fin structure includes a horizontal fin structure extending along a first direction and a vertical fin structure extending along a second direction. The substrate has a first region and a second region. A portion of the horizontal fin structure and the vertical fin structure are disposed in the first region, and the electrical contact structure directly covers the horizontal fin structure and the vertical fin structure within the first region. The gate structure partially overlaps the horizontal fin structure within the second region.
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