Invention Grant
US09000483B2 Semiconductor device with fin structure and fabrication method thereof
有权
具有翅片结构的半导体器件及其制造方法
- Patent Title: Semiconductor device with fin structure and fabrication method thereof
- Patent Title (中): 具有翅片结构的半导体器件及其制造方法
-
Application No.: US13895367Application Date: 2013-05-16
-
Publication No.: US09000483B2Publication Date: 2015-04-07
- Inventor: Shih-Fang Hong , Po-Chao Tsao
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L31/0328
- IPC: H01L31/0328 ; H01L29/94 ; H01L27/088

Abstract:
A semiconductor device includes a substrate, a first fin structure, an electrical contact structure and a gate structure. The first fin structure includes a horizontal fin structure extending along a first direction and a vertical fin structure extending along a second direction. The substrate has a first region and a second region. A portion of the horizontal fin structure and the vertical fin structure are disposed in the first region, and the electrical contact structure directly covers the horizontal fin structure and the vertical fin structure within the first region. The gate structure partially overlaps the horizontal fin structure within the second region.
Public/Granted literature
- US20140339641A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2014-11-20
Information query
IPC分类: