Invention Grant
- Patent Title: Method of fabricating gold nanostructures using electroless displacement plating
- Patent Title (中): 使用无电位移镀法制造金纳米结构的方法
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Application No.: US13608651Application Date: 2012-09-10
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Publication No.: US09001323B2Publication Date: 2015-04-07
- Inventor: Sang Kyung Kim , Sang Hwi Park
- Applicant: Sang Kyung Kim , Sang Hwi Park
- Applicant Address: KR Seoul
- Assignee: Korea Institute of Science and Technology
- Current Assignee: Korea Institute of Science and Technology
- Current Assignee Address: KR Seoul
- Agency: Goldilocks ZONE IP LAW
- Priority: KR10-2011-0106589 20111018
- Main IPC: G01J3/44
- IPC: G01J3/44 ; C22C5/02 ; G01N21/65 ; C23C18/54 ; B82Y30/00 ; B22F1/00 ; B82Y40/00

Abstract:
The present invention provides a method of fabricating gold nanoparticles using electroless displacement plating, the method including the steps of: depositing on a substrate a metal having a reduction potential lower than that of gold to form a metal layer; and reacting a gold ion-containing plating solution with the metal layer. The invention also provides gold nanoparticles fabricated by the method. According to the method, gold nanostructures can be fabricated in a simple, cost-effective and efficient manner, and the fabricated gold nanoparticles can be used to measure surface-enhanced Raman scattering (SERS) signal or fluorescence. In addition, the invention enables the development of an optical sensor including the gold nanostructures.
Public/Granted literature
- US20130094021A1 METHOD OF FABRICATING GOLD NANOSTRUCTURES USING ELECTROLESS DISPLACEMENT PLATING Public/Granted day:2013-04-18
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