Invention Grant
- Patent Title: Packaged device exposed to environmental air and liquids and manufacturing method thereof
- Patent Title (中): 暴露于环境空气和液体的包装设备及其制造方法
-
Application No.: US14013730Application Date: 2013-08-29
-
Publication No.: US09011776B2Publication Date: 2015-04-21
- Inventor: Federico Giovanni Ziglioli , Fulvio Vittorio Fontana , Luca Maggi
- Applicant: STMicroelectronics S.r.I.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicoroelectronics S.r.l.
- Current Assignee: STMicoroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group PLLC
- Priority: ITTO2012A0753 20120830
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00 ; H04R19/04
Abstract:
A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids.
Public/Granted literature
- US20140061892A1 PACKAGED DEVICE EXPOSED TO ENVIRONMENTAL AIR AND LIQUIDS AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-03-06
Information query
