Invention Grant
- Patent Title: Methods for processing substrates
- Patent Title (中): 处理基材的方法
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Application No.: US14147718Application Date: 2014-01-06
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Publication No.: US09023716B2Publication Date: 2015-05-05
- Inventor: Chungsun Lee , Jung-Seok Ahn , Kwang-chul Choi , Un-Byoung Kang , Jung-Hwan Kim , Joonsik Sohn , Jeon Il Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Ellsworth IP Group PLLC
- Priority: KR10-2013-0008692 20130125
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H01L21/304 ; H01L21/683
Abstract:
A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.
Public/Granted literature
- US20140210075A1 METHODS FOR PROCESSING SUBSTRATES Public/Granted day:2014-07-31
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