A test apparatus for testing a semiconductor device includes a circuit board having a contact pattern on one side and an opening therethrough, and a probe card supporting a probe needle array. The probe needle array is insertable into the opening of the circuit board and is configured to probe a device under test. The probe needle array is in electrical contact with the contact pattern of the circuit board, to allow signals through the probe card and circuit board to a test equipment. A holder supports the probe card and other probe cards. The holder has multiple sides, each of which is supportable of a probe card having a probe needle array. The holder is rotatable to manipulate and position the probe needle arrays of the probe cards relative to a device under test. The holder allows disconnection and replacement of the probe needle arrays from the holder.