Invention Grant
- Patent Title: Heat storage microcapsules and manufacturing method thereof
- Patent Title (中): 储热微胶囊及其制备方法
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Application No.: US13311761Application Date: 2011-12-06
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Publication No.: US09028965B2Publication Date: 2015-05-12
- Inventor: Mikio Kouyama , Ken Ohmura
- Applicant: Mikio Kouyama , Ken Ohmura
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta Business Technologies, Inc.
- Current Assignee: Konica Minolta Business Technologies, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Lucas & Mercanti, LLP
- Priority: JP2010-276696 20101213
- Main IPC: B32B15/02
- IPC: B32B15/02 ; B05D7/00 ; B32B3/00 ; C09K5/06 ; F28D20/02

Abstract:
Disclosed are heat storage microcapsules encapsulating a water-soluble heat storage material stably and certainly, heat storage microcapsules with high durability which prevent phase separation of an inorganic salt hydrate latent heat storage material, heat storage microcapsules which prevent supercooling of a latent heat storage material to exhibit stable heat history and a manufacturing method thereof. The heat storage microcapsules comprise a core covered with a shell, wherein the core contains (a) at least one water-soluble latent heat storage material selected from a salt hydrate and a sugar alcohol and (b) a polymer derived from a water-soluble monomer mixture of a water-soluble monofunctional monomer and a water-soluble multifunctional monomer, and the shell is composed of a hydrophobic resin.
Public/Granted literature
- US20120148845A1 HEAT STORAGE MICROCAPSULES AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-06-14
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