Invention Grant
- Patent Title: Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
- Patent Title (中): 微电子组件在通过封装延伸的连接器上具有加强套环
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Application No.: US13942602Application Date: 2013-07-15
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Publication No.: US09034696B2Publication Date: 2015-05-19
- Inventor: Ilyas Mohammed , Belgacem Haba
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/28 ; H01L21/56
Abstract:
A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. Dielectric reinforcing collars are provided on outer surfaces of the first connectors, second connectors or both, and an encapsulation separates pairs of coupled connectors from one another and may fill spaces between support elements.
Public/Granted literature
- US20150014856A1 MICROELECTRONIC ASSEMBLIES HAVING REINFORCING COLLARS ON CONNECTORS EXTENDING THROUGH ENCAPSULATION Public/Granted day:2015-01-15
Information query
IPC分类:
