Invention Grant
- Patent Title: Temperature measuring system, substrate processing apparatus and temperature measuring method
- Patent Title (中): 温度测量系统,基板加工设备和温度测量方法
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Application No.: US13529391Application Date: 2012-06-21
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Publication No.: US09046417B2Publication Date: 2015-06-02
- Inventor: Tatsuo Matsudo , Kenji Nagai
- Applicant: Tatsuo Matsudo , Kenji Nagai
- Applicant Address: JP
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2011-140642 20110624; JP2011-239002 20111031
- Main IPC: G01J3/45
- IPC: G01J3/45 ; G01J5/08 ; G01J5/00

Abstract:
The temperature measuring system using optical interference includes a light source which generates measuring light; a spectroscope which measures an interference intensity distribution that is an intensity distribution of reflected light; optical transfer mechanisms which emit light reflected from a surface and a rear surface of the object to be measured to the spectroscope; an optical path length calculation unit which calculates an optical path length by performing Fourier transformation; and a temperature calculation unit which calculates a temperature of the object to be measured on the basis of a relation between optical path lengths and temperatures. The light source has a half-width at half-maximum of a light source spectrum that satisfies conditions based on a wavelength span of the spectroscope. The spectroscope measures the intensity distribution by using the number of samplings that satisfies conditions based on the wavelength span and a maximum measurable thickness.
Public/Granted literature
- US20120327394A1 TEMPERATURE MEASURING SYSTEM, SUBSTRATE PROCESSING APPARATUS AND TEMPERATURE MEASURING METHOD Public/Granted day:2012-12-27
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