Invention Grant
- Patent Title: Transmission line RF applicator for plasma chamber
- Patent Title (中): 用于等离子体室的传输线RF施加器
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Application No.: US13507383Application Date: 2012-06-21
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Publication No.: US09048518B2Publication Date: 2015-06-02
- Inventor: Jozef Kudela , Tsutomu Tanaka , Carl A. Sorensen , Suhail Anwar , John M. White , Ranjit Indrajit Shinde , Seon-Mee Cho , Douglas D. Truong
- Applicant: Jozef Kudela , Tsutomu Tanaka , Carl A. Sorensen , Suhail Anwar , John M. White , Ranjit Indrajit Shinde , Seon-Mee Cho , Douglas D. Truong
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Robert J. Stern
- Main IPC: H01J17/26
- IPC: H01J17/26 ; H01J61/28 ; H01P3/00 ; H05H1/24 ; H01P11/00 ; H01J37/32 ; H05H1/46 ; H01P3/06 ; H01P3/08 ; H01Q13/22
Abstract:
A transmission line RF applicator apparatus and method for coupling RF power to a plasma in a plasma chamber. The apparatus comprises an inner conductor and one or two outer conductors. The main portion of each of the one or two outer conductors includes a plurality of apertures that extend between an inner surface and an outer surface of the outer conductor.
Public/Granted literature
- US20130221833A1 Transmission line RF applicator for plasma chamber Public/Granted day:2013-08-29
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