Invention Grant
US09049778B2 Polyamic acid, photosensitive resin composition, dry film and circuit board
有权
聚酰胺酸，感光性树脂组合物，干膜和电路板
- Patent Title: Polyamic acid, photosensitive resin composition, dry film and circuit board
- Patent Title (中): 聚酰胺酸，感光性树脂组合物，干膜和电路板
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Application No.: US14006062Application Date: 2012-03-19
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Publication No.: US09049778B2Publication Date: 2015-06-02
- Inventor: You-Jin Kyung , Hee-Jung Kim , Kwang-Joo Lee , Jung-Hak Kim
- Applicant: You-Jin Kyung , Hee-Jung Kim , Kwang-Joo Lee , Jung-Hak Kim
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2011-0024523 20110318; KR10-2011-0038030 20110422
- International Application: PCT/KR2012/001963 WO 20120319
- International Announcement: WO2012/128526 WO 20120927
- Main IPC: C08J3/28
- IPC: C08J3/28 ; C08F2/46 ; C08G61/04 ; H05K3/00 ; H05K3/28 ; C08G73/10 ; C08L79/08 ; C09D179/08 ; G03F7/031 ; G03F7/037
Abstract:
The present invention relates to novel polyamic acid; a photosensitive resin composition satisfying excellent flexibility and low stiffness and exhibiting excellent heat resistance and plating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.
Public/Granted literature
- US20140011905A1 NOVEL POLYAMIC ACID, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND CIRCUIT BOARD Public/Granted day:2014-01-09
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