Invention Grant
- Patent Title: Solar module integration system with thermal compensation
- Patent Title (中): 太阳能模块集成系统具有热补偿功能
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Application No.: US13619201Application Date: 2012-09-14
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Publication No.: US09052123B2Publication Date: 2015-06-09
- Inventor: David Anderson , Vasilije Jovanovic
- Applicant: David Anderson , Vasilije Jovanovic
- Applicant Address: US MA North Andover
- Assignee: PanelClaw Group, Inc.
- Current Assignee: PanelClaw Group, Inc.
- Current Assignee Address: US MA North Andover
- Agency: Foley & Lardner LLP
- Agent Christopher J. McKenna
- Main IPC: E04D13/18
- IPC: E04D13/18 ; F24J2/52 ; H01L31/042 ; H02S20/24
Abstract:
An apparatus for supporting a solar module is disclosed including: a first support member; a first wind deflector configured to be attached to the first support member; and a first attachment mechanism configured to attach the first support member to the first wind deflector and allow local motion of the first wind deflector relative to the first support member in response to thermal expansion or contraction of the first wind deflector.
Public/Granted literature
- US20130015303A1 SOLAR MODULE INTEGRATION SYSTEM WITH THERMAL COMPENSATION Public/Granted day:2013-01-17
Information query
