The present disclosure provides a light-emitting diode package, including: a carrier; a light-emitting diode chip disposed over the carrier and electrically connected to the carrier, wherein the light-emitting diode chip includes at least two recesses at corners located on a diagonal line of the light-emitting diode chip; a eutectic layer disposed between the light-emitting diode chip and the carrier, wherein the eutectic layer includes at least two metal pillars embedded into the at least two recesses respectively, wherein an upper portion of the metal pillars covers a portion of a top surface of the light-emitting diode chip. The present disclosure also provides a method for manufacturing a light-emitting diode package.