Invention Grant
- Patent Title: Display device package and packaging process thereof
- Patent Title (中): 显示设备包装及其包装过程
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Application No.: US13891206Application Date: 2013-05-10
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Publication No.: US09055669B2Publication Date: 2015-06-09
- Inventor: Wen-Hao Wu
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99111443A 20100413
- Main IPC: B44F1/00
- IPC: B44F1/00 ; C09K11/00 ; H01J9/227 ; B29C65/00 ; B32B37/00 ; B32B38/04 ; H01J1/62 ; H01J63/04 ; H05K1/02 ; C09J5/00 ; H01L51/52 ; H05K1/18 ; B29C65/16 ; B29C65/48 ; B32B37/12 ; G02F1/1333
Abstract:
An display device package including a first substrate, an display device, a second substrate, a welding glue, and a first adhesive layer is provided. The display device is disposed on the first substrate. The second substrate is disposed above the first substrate and the display device. The welding glue is welded with the first substrate and the second substrate and surrounds the display device, wherein the welding glue has a continuous pattern. The first adhesive layer is adhered to the first substrate and the second substrate, wherein the first adhesive layer is disposed between the display device and the welding glue and surrounds the display device, and the material of the first adhesive layer and the material of the welding glue are different.
Public/Granted literature
- US20130242512A1 DISPLAY DEVICE PACKAGE AND PACKAGING PROCESS THEREOF Public/Granted day:2013-09-19
Information query
