Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13937764Application Date: 2013-07-09
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Publication No.: US09056765B2Publication Date: 2015-06-16
- Inventor: Jong Dae Jung , Dong Hyun Bang , Yung Woo Lee , EunNaRa Cho , Byung Jun Kim
- Applicant: Amkor Technology, Inc.
- Agency: McAndrews, Held & Malloy
- Priority: KR10-2012-0074947 20120710
- Main IPC: G01R31/26
- IPC: G01R31/26 ; H01L21/66 ; B81C1/00 ; H01L23/00 ; H01L23/055 ; H01L23/31 ; B81B7/00 ; H01L21/56
Abstract:
Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.
Public/Granted literature
- US20140017843A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-01-16
Information query
