Invention Grant
- Patent Title: Layout structure of electronic element and testing method of the same thereof
- Patent Title (中): 电子元件的布局结构及其测试方法
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Application No.: US13744498Application Date: 2013-01-18
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Publication No.: US09063193B2Publication Date: 2015-06-23
- Inventor: Chun-Ming Chang , Chun-Liang Hou , Wen-Jung Liao
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: G01R1/073
- IPC: G01R1/073 ; H01L21/00 ; G01R31/26 ; H01L21/66
Abstract:
A layout structure of an electronic element including an electronic matrix, a first load and a second load is disclosed. The first load couples to a first end of the electronic matrix and includes a first testing pad and a second testing pad coupling to the first testing pad. The second load couples to a second end of the electronic matrix and includes a third testing pad and a fourth testing pad coupling to the third testing pad.
Public/Granted literature
- US20140203828A1 LAYOUT STRUCTURE OF ELECTRONIC ELEMENT AND TESTING METHOD OF THE SAME THEREOF Public/Granted day:2014-07-24
Information query
