Invention Grant
- Patent Title: Circuit board having bypass pad
- Patent Title (中): 电路板，旁路板
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Application No.: US14104315Application Date: 2013-12-12
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Publication No.: US09069036B2Publication Date: 2015-06-30
- Inventor: Sang-Guk Han , Seok-Joon Moon , Beom-jun Jin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2007-0129057 20071212
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28 ; H01L23/538 ; H05K1/02 ; H01L21/66 ; H01L25/065 ; H01L25/18 ; H05K1/11 ; H05K3/28 ; H05K3/32 ; H01L23/00
Abstract:
An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.
Public/Granted literature
- US20140097865A1 CIRCUIT BOARD HAVING BYPASS PAD Public/Granted day:2014-04-10
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