Invention Grant
- Patent Title: Method for fabricating blackened conductive patterns
- Patent Title (中): 黑色导电图案的制造方法
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Application No.: US12747331Application Date: 2008-12-10
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Publication No.: US09107317B2Publication Date: 2015-08-11
- Inventor: Kwang Choon Chung , Ji Hoon Yoo , Byung Hun Kim , Su Han Kim
- Applicant: Kwang Choon Chung , Ji Hoon Yoo , Byung Hun Kim , Su Han Kim
- Applicant Address: KR Kyeongki-do
- Assignee: Inktec Co., Ltd.
- Current Assignee: Inktec Co., Ltd.
- Current Assignee Address: KR Kyeongki-do
- Agency: The Webb Law Firm
- Priority: KR10-2007-0128149 20071211
- International Application: PCT/KR2008/007307 WO 20081210
- International Announcement: WO2009/075520 WO 20090618
- Main IPC: B05D3/06
- IPC: B05D3/06 ; B05D5/12 ; B05D5/06 ; H05K3/12 ; H05K3/00 ; C23C18/18 ; C23C18/20 ; C23C18/16 ; H05K1/09 ; H05K3/10 ; H05K3/24

Abstract:
The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.
Public/Granted literature
- US20110003086A1 Method for Fabricating Blackened Conductive Patterns Public/Granted day:2011-01-06
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