Invention Grant
US09110037B2 Diode laser based broad band light sources for wafer inspection tools
有权
用于晶圆检测工具的基于二极管激光的宽带光源
- Patent Title: Diode laser based broad band light sources for wafer inspection tools
- Patent Title (中): 用于晶圆检测工具的基于二极管激光的宽带光源
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Application No.: US14521977Application Date: 2014-10-23
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Publication No.: US09110037B2Publication Date: 2015-08-18
- Inventor: Anant Chimmalgi , Younus Vora , Rudolf Brunner
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Kwan & Olynick LLP
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/95 ; G01N21/88 ; G03F7/20 ; G01N21/956

Abstract:
Disclosed are methods and apparatus for performing inspection or metrology of a semiconductor device. The apparatus includes a plurality of laser diode arrays that are configurable to provide an incident beam having different wavelength ranges. At least some of the laser diode arrays form two dimensional stacks that have different wavelength ranges from each other. The apparatus also includes optics for directing the incident beam towards the sample, a detector for generating an output signal or image based on an output beam emanating from the sample in response to the incident beam, and optics for directing the output beam towards the detector. The apparatus further includes a controller for configuring the laser diode arrays to provide the incident beam at the different wavelength ranges and detecting defects or characterizing a feature of the sample based on the output signal or image.
Public/Granted literature
- US20150042979A1 DIODE LASER BASED BROAD BAND LIGHT SOURCES FOR WAFER INSPECTION TOOLS Public/Granted day:2015-02-12
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