Invention Grant
- Patent Title: Method of fabricating semiconductor package structure
- Patent Title (中): 制造半导体封装结构的方法
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Application No.: US14095144Application Date: 2013-12-03
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Publication No.: US09111948B2Publication Date: 2015-08-18
- Inventor: Tzyy-Jang Tseng , Dyi-Chung Hu , Yu-Shan Hu
- Applicant: Unimicron Technology Corporation
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corporation
- Current Assignee: Unimicron Technology Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steve M. Jensen
- Priority: TW100114747A 20110427
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/433 ; H01L23/498 ; H01L23/538 ; H01L23/00 ; H01L21/768 ; H01L23/36
Abstract:
A semiconductor package structure is provided, including: a semiconductor chip having electrode pads disposed thereon and metal bumps disposed on the electrode pads; an encapsulant encapsulating the semiconductor chip; a dielectric layer formed on the encapsulant and having a plurality of patterned intaglios formed therein for exposing the metal bumps; a wiring layer formed in the patterned intaglios of the dielectric layer and electrically connected to the metal bumps; and a metal foil having a plurality of metal posts disposed on a surface thereof such that the metal foil is disposed on the encapsulant with the metal posts penetrating the encapsulant so as to extend to the inactive surface of the semiconductor chip. Compared with the prior art, the present invention reduces the overall thickness of the package structure, increases the electrical transmission efficiency and improves the heat dissipating effect.
Public/Granted literature
- US20140084463A1 METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2014-03-27
Information query
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