Invention Grant
- Patent Title: Backside illuminated CMOS image sensor
- Patent Title (中): 背面照明CMOS图像传感器
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Application No.: US13416004Application Date: 2012-03-09
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Publication No.: US09123608B2Publication Date: 2015-09-01
- Inventor: Shiu-Ko JangJian , Volume Chien , Szu-An Wu
- Applicant: Shiu-Ko JangJian , Volume Chien , Szu-An Wu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146

Abstract:
A backside illuminated CMOS image sensor comprises a photo active region formed over a substrate using a front side ion implantation process and an extended photo active region formed adjacent to the photo active region, wherein the extended photo active region is formed by using a backside ion implantation process. The backside illuminated CMOS image sensor may further comprise a laser annealed layer on the backside of the substrate. The extended photo active region helps to increase the number of photons converted into electrons so as to improve quantum efficiency.
Public/Granted literature
- US20130149807A1 Backside Illuminated CMOS Image Sensor Public/Granted day:2013-06-13
Information query
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