A method of manufacturing a passive component module includes the steps of: bonding passive components to a carrier, wherein each of the passive components has interconnection pads; forming a dielectric molding material over the carrier, so that the passive components are embedded in the molding material; separating the molding material, which has the passive components embedded therein, from the carrier; exposing all interconnection pads of the passive components; and building electrical interconnections between the passive components to obtain the passive component module. The steps of bonding, forming, separating, exposing and building are performed in the recited order.