Invention Grant
- Patent Title: Plating pretreatment solution and method for producing aluminum substrate for hard disk devices using same
- Patent Title (中): 电镀预处理液及其制造方法
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Application No.: US13981355Application Date: 2012-01-19
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Publication No.: US09127170B2Publication Date: 2015-09-08
- Inventor: Nobuaki Mukai , Takahiro Yoshida
- Applicant: Nobuaki Mukai , Takahiro Yoshida
- Applicant Address: JP Tokyo
- Assignee: Toyo Kohan Co., Ltd.
- Current Assignee: Toyo Kohan Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: McCarter & English
- Priority: JP2011-013139 20110125
- International Application: PCT/JP2012/051049 WO 20120119
- International Announcement: WO2012/102161 WO 20120802
- Main IPC: G11B5/84
- IPC: G11B5/84 ; C09D1/00 ; C23C18/18 ; C23C18/32 ; B05D3/10

Abstract:
An object of the invention is to provide a plating pretreatment solution that can convert the surface of an aluminum substrate for hard disk devices into a surface suitable for electroless nickel plating, and a method for producing an aluminum substrate for hard disk devices using the same. The plating pretreatment solution of the present invention used for a plating pretreatment in production of an aluminum substrate for hard disk devices has an iron ion concentration of 0.1 g/l to 1.0 g/l and a nitric acid concentration of 2.0 wt % to 12.0 wt %. This plating pretreatment solution is used for a pretreatment of a plating step in which electroless nickel plating is applied to an aluminum substrate for hard disk devices. Accordingly, the surface of the aluminum substrate for hard disk devices is converted into a surface suitable for electroless Ni plating, and a smooth surface of a plated film is obtained by suppressing generation of waviness, nodules, and pits on the plated surface when electroless nickel plating is performed in the plating step.
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