Invention Grant
US09129975B2 Method of forming a thin substrate chip scale package device and structure
有权
形成薄衬底芯片级封装器件和结构的方法
- Patent Title: Method of forming a thin substrate chip scale package device and structure
- Patent Title (中): 形成薄衬底芯片级封装器件和结构的方法
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Application No.: US13750022Application Date: 2013-01-25
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Publication No.: US09129975B2Publication Date: 2015-09-08
- Inventor: Kyoung Yeon Lee , Byong Jin Kim , Gi Jeong Kim
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agent Kevin B. Jackson
- Priority: KR10-2012-0040673 20120419
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L21/48 ; H01L29/06 ; H01L23/31
Abstract:
In one embodiment, a method for forming an electronic package structure includes providing a single unit leadframe having first terminals on a first or top surface. An electronic device is attached to the single unit leadframe and electrically connected to the first terminals. The leadframe, first terminals, and the electronic device are encapsulated with an encapsulating material. Second terminals are then formed by removing portions of a second or bottom surface of the leadframe. In one embodiment, the method can be used to fabricate a thin substrate chip scale package (“tsCSP”) type structure.
Public/Granted literature
- US20130277815A1 METHOD OF FORMING A THIN SUBSTRATE CHIP SCALE PACKAGE DEVICE AND STRUCTURE Public/Granted day:2013-10-24
Information query
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