Invention Grant
- Patent Title: Edge ring for a thermal processing chamber
- Patent Title (中): 用于热处理室的边缘环
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Application No.: US14287782Application Date: 2014-05-27
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Publication No.: US09130001B2Publication Date: 2015-09-08
- Inventor: Blake Koelmel , Joseph M. Ranish , Abhilash J. Mayur
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: F27B5/00
- IPC: F27B5/00 ; F27B5/06 ; F27D5/00 ; H01L21/673 ; F27D11/12 ; H01L21/687 ; H01L21/67
Abstract:
Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more fins formed on an energy receiving surface of the edge ring. The fins may have at least one sloped side relative to a main body of the edge ring.
Public/Granted literature
- US20140270736A1 EDGE RING FOR A THERMAL PROCESSING CHAMBER Public/Granted day:2014-09-18
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