Invention Grant
- Patent Title: Relief plug-in connector and multilayer circuit board
- Patent Title (中): 浮雕插入式连接器和多层电路板
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Application No.: US13514347Application Date: 2010-12-03
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Publication No.: US09131632B2Publication Date: 2015-09-08
- Inventor: Roland Moedinger
- Applicant: Roland Moedinger
- Applicant Address: DE Adelberg
- Assignee: ERNI Production GmbH & Co. KG
- Current Assignee: ERNI Production GmbH & Co. KG
- Current Assignee Address: DE Adelberg
- Agency: Collard & Roe, P.C.
- Priority: DE102009057260 20091208
- International Application: PCT/DE2010/001405 WO 20101203
- International Announcement: WO2011/069485 WO 20110616
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K3/30 ; H01R12/58 ; H01R12/72 ; H01R13/6587 ; H05K1/02

Abstract:
A multipole relief plug-in Connector includes contact elements, the contacting sections of which are arranged in height-offset contact area surfaces, and a multilayer circuit board includes several height-offset contact area surfaces accordingly. In combination, the multipole relief plug-in connector contacts the multilayer circuit board and the multilayer circuit board populates the multipole relief plug-in connector. The contact elements of the relief plug-in connector are designed in the contacting section as press-in contacts for pressing into press-in contact receiving portions of the multilayer circuit board. Contact element receiving portions of the multilayer circuit board are arranged in the contact area surfaces of the multilayer circuit board, the contact element receiving portions being designed as press-in contact receiving portions. A production method produces the multilayer circuit board.
Public/Granted literature
- US20120244753A1 RELIEF PLUG-IN CONNECTOR AND MULTILAYER CIRCUIT BOARD Public/Granted day:2012-09-27
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