Invention Grant
- Patent Title: Highly ordered arrays of nanoholes in metallic films and methods for producing the same
- Patent Title (中): 金属膜中的高排列纳米孔阵列及其制造方法
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Application No.: US13203985Application Date: 2009-03-05
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Publication No.: US09132445B2Publication Date: 2015-09-15
- Inventor: Claudia Pacholski , Stefan B. Quint
- Applicant: Claudia Pacholski , Stefan B. Quint
- Applicant Address: DE Munich
- Assignee: Max-Planck-Gesellschaft zur Foerderung der Wissenschaften e.V.
- Current Assignee: Max-Planck-Gesellschaft zur Foerderung der Wissenschaften e.V.
- Current Assignee Address: DE Munich
- Agency: Caesar Rivise, PC
- International Application: PCT/EP2009/001574 WO 20090305
- International Announcement: WO2010/099805 WO 20100910
- Main IPC: C23C14/04
- IPC: C23C14/04 ; C23C18/06 ; B05D1/00 ; B05D1/32 ; B82Y30/00 ; B82Y40/00 ; C23C18/16 ; C23C18/18 ; C23C18/44 ; G01N21/552

Abstract:
The present invention relates to highly ordered arrays of nanoholes in metallic films and to an improved method for producing the same. The method according to the invention for producing an highly ordered array of nanoholes in metallic films on a substrate comprises the following steps: a) providing microspheres comprising poly-N-isopropylamide (polyNIPAM), the microspheres being selected from pure poly-N-isopropyl-amide (polyNIPAM) hydrogel microspheres and polymeric or inorganic beads carrying poly-N-isopropylamide (polyNIPAM) hydrogel chains, b) coating an aqueous dispersion of said microspheres onto a substrate and drying the dispersion, which results in a non-close packed ordered array of the microspheres, c) generating a metallic film on the substrate, d) removing the microspheres from the surface of the substrate which results in an ordered array of nanoholes on the substrate, and e) optionally increasing the thickness of the metallic film by selective electroless plating.
Public/Granted literature
- US20120028029A1 HIGHLY ORDERED ARRAYS OF NANOHOLES IN METALLIC FILMS AND METHODS FOR PRODUCING THE SAME Public/Granted day:2012-02-02
Information query
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