Invention Grant
- Patent Title: Structure and method for E-beam writing
- Patent Title (中): 电子束写入的结构和方法
-
Application No.: US13442635Application Date: 2012-04-09
-
Publication No.: US09136092B2Publication Date: 2015-09-15
- Inventor: Chi-Ta Lu , Jia-Guei Jou , Yi-Hsien Chen , Peng-Ren Chen , Dong-Hsu Cheng
- Applicant: Chi-Ta Lu , Jia-Guei Jou , Yi-Hsien Chen , Peng-Ren Chen , Dong-Hsu Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G03F1/00 ; H01J37/317 ; G03F1/36 ; G03F1/70 ; H01J37/302 ; G03F7/20

Abstract:
The present disclosure provides one embodiment of an integrated circuit (IC) method. The method includes receiving an IC design layout having a main feature; performing an optical proximity correction (OPC) process to the design layout; and thereafter, performing a jog reduction process to the design layout such that jog features of the design layout are reduced.
Public/Granted literature
- US20130268901A1 Structure and Method for E-Beam Writing Public/Granted day:2013-10-10
Information query