Invention Grant
- Patent Title: Compact 3-D coplanar transmission lines
- Patent Title (中): 紧凑型3-D共面传输线
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Application No.: US13914474Application Date: 2013-06-10
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Publication No.: US09136574B2Publication Date: 2015-09-15
- Inventor: Daeik Daniel Kim , David Francis Berdy , Jonghae Kim , Chengjie Zuo , Changhan Hobie Yun , Mario Francisco Velez , Je-Hsiung Jeffrey Lan , Robert Paul Mikulka
- Applicant: QUALCOMM MEMS Technologies, Inc.
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P3/02 ; H05K1/02 ; H01P3/00

Abstract:
This disclosure provides systems, methods and apparatus for a compact 3-D coplanar transmission line (CTL). In one aspect, the CTL has a proximal end and a distal end separated, in a first plane, by a distance D, the first plane being parallel to a layout area of a substrate. The plane is defined by mutually orthogonal axes x and z The CTL provides a conductive path having pathlength L. D is substantially aligned along axis z, L is at least 1.5×D, and the CPW is configured such that at least one third of the pathlength L is disposed along one or more directions having a substantial component orthogonal to the first plane. Less than one third of the pathlength L is disposed in a direction having a substantial component parallel to axis x.
Public/Granted literature
- US20140361854A1 COMPACT 3-D COPLANAR TRANSMISSION LINES Public/Granted day:2014-12-11
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