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公开(公告)号：US09136574B2
公开(公告)日：2015-09-15
申请号：US13914474
申请日：2013-06-10
Applicant: QUALCOMM MEMS Technologies, Inc.
Inventor： Daeik Daniel Kim , David Francis Berdy , Jonghae Kim , Chengjie Zuo , Changhan Hobie Yun , Mario Francisco Velez , Je-Hsiung Jeffrey Lan , Robert Paul Mikulka
CPC classification number: H01P3/026 , H01P3/003 , H05K1/0237
Abstract: This disclosure provides systems, methods and apparatus for a compact 3-D coplanar transmission line (CTL). In one aspect, the CTL has a proximal end and a distal end separated, in a first plane, by a distance D, the first plane being parallel to a layout area of a substrate. The plane is defined by mutually orthogonal axes x and z The CTL provides a conductive path having pathlength L. D is substantially aligned along axis z, L is at least 1.5×D, and the CPW is configured such that at least one third of the pathlength L is disposed along one or more directions having a substantial component orthogonal to the first plane. Less than one third of the pathlength L is disposed in a direction having a substantial component parallel to axis x.
Abstract translation: 本公开提供了用于紧凑型3-D共面传输线（CTL）的系统，方法和装置。 在一个方面，CTL具有在第一平面中距离D分开的近端和远端，第一平面平行于衬底的布局区域。 平面由相互正交的轴x和z定义。CTL提供具有路径长度L的导电路径.D沿轴线z基本对准，L至少为1.5×D，并且CPW被配置为使得至少三分之一的 路径长度L沿着具有与第一平面正交的实质分量的一个或多个方向布置。 路径长度L的三分之一以具有平行于轴线x的基本分量的方向设置。
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2.发明申请公开(公告)号：US20140247269A1
公开(公告)日：2014-09-04
申请号：US13784580
申请日：2013-03-04
Applicant: QUALCOMM MEMS Technologies, Inc.
Inventor： David Francis Berdy , Jonghae Kim , Chengjie Zuo , Daeik Daniel Kim , Changhan Hobie Yun , Mario Francisco Velez , Je-Hsiung Jeffrey Lan
CPC classification number: H01F17/0006 , G06T1/00 , H01F1/24 , H01F1/37 , H01F17/0033 , H01F41/046 , H01L23/15 , H01L23/498 , H01L23/49822 , H01L28/10 , H01L2924/0002 , H05K1/0306 , H05K1/165 , H05K3/4046 , H05K2201/086 , H05K2201/09063 , H05K2201/097 , H05K2201/10242 , H01L2924/00
Abstract: This disclosure provides systems, methods and apparatus for three-dimensional (3-D) through-glass via inductors. In one aspect, the through-glass via inductor includes a glass substrate with a first cavity, a second cavity, and at least two through-glass vias. The through-glass vias include metal bars that are connected by a metal trace. The metal bars and the metal trace define the inductor, and each cavity is at least partially filled with magnetic material. The magnetic material can include a plurality of particles having an average diameter of less than about 20 nm. The first cavity can be inside the inductor and the second cavity can be outside inductor. In some implementations, the first and the second cavity can be vias that extend only partially through the glass substrate.
Abstract translation: 本公开提供用于三维（3-D）透玻璃通孔电感器的系统，方法和装置。 一方面，透玻璃通孔电感器包括具有第一空腔，第二空腔和至少两个透玻璃通孔的玻璃基板。 透玻璃通孔包括通过金属迹线连接的金属棒。 金属棒和金属迹线限定电感器，并且每个空腔至少部分地填充有磁性材料。 磁性材料可以包括平均直径小于约20nm的多个颗粒。 第一个腔可以在电感内部，第二个腔可以是外部电感。 在一些实施方案中，第一和第二腔可以是仅部分延伸穿过玻璃基底的通孔。
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公开(公告)号：US09331666B2
公开(公告)日：2016-05-03
申请号：US13657653
申请日：2012-10-22
Applicant: QUALCOMM MEMS Technologies, Inc.
Inventor： Chengjie Zuo , Jonghae Kim , Changhan Hobie Yun , Sang-June Park , Philip Jason Stephanou , Chi Shun Lo , Robert Paul Mikulka , Mario Francisco Velez , Ravindra V. Shenoy , Matthew Michael Nowak
IPC: H01L41/047 , H03H9/02 , H03H9/205 , H03H9/24
CPC classification number: H03H9/02157 , H03H9/02574 , H03H9/205 , H03H9/2405 , H03H2009/02503 , H03H2009/02527 , H03H2009/241
Abstract: This disclosure provides systems, methods and apparatus related to acoustic resonators that include composite transduction layers for enabling selective tuning of one or more acoustic or electromechanical properties. In one aspect, a resonator structure includes one or more first electrodes, one or more second electrodes, and a transduction layer arranged between the first and second electrodes. The transduction layer includes a plurality of constituent layers. In some implementations, the constituent layers include one or more first piezoelectric layers and one or more second piezoelectric layers. The transduction layer is configured to, responsive to signals provided to the first and second electrodes, provide at least a first mode of vibration of the transduction layer with a displacement component along the z axis and at least a second mode of vibration of the transduction layer with a displacement component along the plane of the x axis and they axis.
Abstract translation: 本公开提供了与声谐振器相关的系统，方法和装置，其包括用于使得能够选择性地调谐一个或多个声学或机电特性的复合转导层。 一方面，谐振器结构包括一个或多个第一电极，一个或多个第二电极和布置在第一和第二电极之间的换能层。 换能层包括多个构成层。 在一些实施方式中，构成层包括一个或多个第一压电层和一个或多个第二压电层。 转导层被配置为响应于提供给第一和第二电极的信号，提供至少第一传感模式的振动，沿着z轴的位移分量和换能层的至少第二振动模式 具有沿着x轴的平面并且它们的轴线的位移分量。
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公开(公告)号：US09363902B2
公开(公告)日：2016-06-07
申请号：US14326189
申请日：2014-07-08
Applicant: QUALCOMM MEMS Technologies, Inc.
Inventor： Chi Shun Lo , Jonghae Kim , Chengjie Zuo , Changhan Hobie Yun
CPC classification number: H05K3/465 , H01F27/2804 , H01F2017/002 , H01F2017/004
Abstract: This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another.
Abstract translation: 本公开提供了电感器，变压器和相关过程的实现。 一方面，一种装置包括具有第一表面和第二表面的基底。 第一感应装置包括第一组通孔，第二组通孔，布置在连接第一和第二通孔的第一表面上的第一组迹线，以及布置在第二表面上的第二组迹线，该第二组迹线连接第一和第二通孔 通孔 第二感应装置与第一感应装置电感耦合和交错，并且包括第三组通孔，第四组通孔，布置在连接第三和第四通孔的第一表面上的第三组迹线和第四组 布置在连接第三和第四通孔的第二表面上的迹线。 一组或多组电介质层将迹线的一部分彼此绝缘。
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Patent Agency Ranking
公开(公告)号：US09337799B2
公开(公告)日：2016-05-10
申请号：US13667918
申请日：2012-11-02
Applicant: QUALCOMM MEMS Technologies, Inc.
Inventor： Philip Jason Stephanou , Chengjie Zuo , Changhan Hobie Yun , Sang-June Park , Charles Chengyea Leu , Jonghae Kim , Ravindra V. Shenoy
CPC classification number: H03H9/02149 , H03H3/02 , H03H2003/021 , H03H2003/025 , H03H2003/028 , Y10T29/42
Abstract: This disclosure provides implementations of methods, apparatus and systems for producing acoustic wave devices and for selectively modifying one or more acoustic or electromechanical characteristics of such devices. In one aspect, a method includes depositing a structural layer over a substrate. The structural layer includes a plurality of structural portions, each being positioned over a corresponding device region. The method also includes arranging a mask layer over the structural layer. The mask layer includes a plurality of mask portions, each including a number of mask openings that expose a corresponding region of the structural portion. The method also includes accelerating dopant particles toward the mask layer. The accelerated dopant particles that proceed through the mask openings are impacted into the corresponding structural portion. The impacted dopant particles modify material properties in the structural portion, which then effect a change in the acoustic or electromechanical characteristics of the acoustic wave device.
Abstract translation: 本公开提供了用于产生声波装置并用于选择性地修改这种装置的一个或多个声学或机电特性的方法，装置和系统的实现。 一方面，一种方法包括在衬底上沉积结构层。 结构层包括多个结构部分，每个结构部分位于相应的装置区域上。 该方法还包括在结构层上布置掩模层。 掩模层包括多个掩模部分，每个掩模部分包括暴露结构部分的对应区域的多个掩模开口。 该方法还包括向掩模层加速掺杂剂颗粒。 进入掩模开口的加速掺杂剂颗粒被冲击到相应的结构部分。 受影响的掺杂剂颗粒改变结构部分中的材料性质，其然后影响声波装置的声学或机电特性的变化。
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公开(公告)号：US20140361854A1
公开(公告)日：2014-12-11
申请号：US13914474
申请日：2013-06-10
Applicant: QUALCOMM MEMS Technologies, Inc.
Inventor： Daeik Daniel Kim , David Francis Berdy , Jonghae Kim , Chengjie Zuo , Changhan Hobie Yun , Mario Francisco Velez , Je-Hsiung Jeffrey Lan , Robert Paul Mikulka
CPC classification number: H01P3/026 , H01P3/003 , H05K1/0237
Abstract: This disclosure provides systems, methods and apparatus for a compact 3-D coplanar transmission line (CTL). In one aspect, the CTL has a proximal end and a distal end separated, in a first plane, by a distance D, the first plane being parallel to a layout area of a substrate. The plane is defined by mutually orthogonal axes x and z The CTL provides a conductive path having pathlength L. D is substantially aligned along axis z, L is at least 1.5×D, and the CPW is configured such that at least one third of the pathlength L is disposed along one or more directions having a substantial component orthogonal to the first plane. Less than one third of the pathlength L is disposed in a direction having a substantial component parallel to axis x.
Abstract translation: 本公开提供了用于紧凑型3-D共面传输线（CTL）的系统，方法和装置。 在一个方面，CTL具有在第一平面中距离D分开的近端和远端，第一平面平行于衬底的布局区域。 平面由相互正交的轴x和z定义。CTL提供具有路径长度L的导电路径.D沿轴线z基本对准，L至少为1.5×D，并且CPW被配置为使得至少三分之一的 路径长度L沿着具有与第一平面正交的实质分量的一个或多个方向布置。 路径长度L的三分之一以具有平行于轴线x的基本分量的方向设置。
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公开(公告)号：US20140322435A1
公开(公告)日：2014-10-30
申请号：US14326189
申请日：2014-07-08
Applicant: QUALCOMM MEMS Technologies, Inc.
Inventor： Chi Shun Lo , Jonghae Kim , Chengjie Zuo , Changhan Hobie Yun
IPC: H05K3/46
CPC classification number: H05K3/465 , H01F27/2804 , H01F2017/002 , H01F2017/004
Abstract: This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another.
Abstract translation: 本公开提供了电感器，变压器和相关过程的实现。 一方面，一种装置包括具有第一表面和第二表面的基底。 第一感应装置包括第一组通孔，第二组通孔，布置在连接第一和第二通孔的第一表面上的第一组迹线，以及布置在第二表面上的第二组迹线，该第二组迹线连接第一和第二通孔 通孔 第二感应装置与第一感应装置电感耦合和交错，并且包括第三组通孔，第四组通孔，布置在连接第三和第四通孔的第一表面上的第三组迹线和第四组 布置在连接第三和第四通孔的第二表面上的迹线。 一组或多组电介质层将迹线的一部分彼此绝缘。
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公开(公告)号：US20140111064A1
公开(公告)日：2014-04-24
申请号：US13657653
申请日：2012-10-22
Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
Inventor： Chengjie Zuo , Jonghae Kim , Changhan Hobie Yun , Sang-June Park , Philip Jason Stephanou , Chi Shun Lo , Robert Paul Mikulka , Mario Francisco Velez , Ravindra V. Shenoy , Matthew Michael Nowak
IPC: H01L41/083 , H01L41/18
CPC classification number: H03H9/02157 , H03H9/02574 , H03H9/205 , H03H9/2405 , H03H2009/02503 , H03H2009/02527 , H03H2009/241
Abstract: This disclosure provides systems, methods and apparatus related to acoustic resonators that include composite transduction layers for enabling selective tuning of one or more acoustic or electromechanical properties. In one aspect, a resonator structure includes one or more first electrodes, one or more second electrodes, and a transduction layer arranged between the first and second electrodes. The transduction layer includes a plurality of constituent layers. In some implementations, the constituent layers include one or more first piezoelectric layers and one or more second piezoelectric layers. The transduction layer is configured to, responsive to signals provided to the first and second electrodes, provide at least a first mode of vibration of the transduction layer with a displacement component along the z axis and at least a second mode of vibration of the transduction layer with a displacement component along the plane of the x axis and they axis.
Abstract translation: 本公开提供了与声谐振器相关的系统，方法和装置，其包括用于使得能够选择性地调谐一个或多个声学或机电特性的复合转导层。 一方面，谐振器结构包括一个或多个第一电极，一个或多个第二电极和布置在第一和第二电极之间的换能层。 换能层包括多个构成层。 在一些实施方式中，构成层包括一个或多个第一压电层和一个或多个第二压电层。 转导层被配置为响应于提供给第一和第二电极的信号，提供至少第一传感模式的振动，沿着z轴的位移分量和换能层的至少第二振动模式 具有沿着x轴的平面并且它们的轴线的位移分量。
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公开(公告)号：US20140125432A1
公开(公告)日：2014-05-08
申请号：US13667918
申请日：2012-11-02
Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
Inventor： Philip Jason Stephanou , Chengjie Zuo , Changhan Hobie Yun , Sang-June Park , Charles Chengyea Leu , Jonghae Kim , Ravindra V. Shenoy
CPC classification number: H03H9/02149 , H03H3/02 , H03H2003/021 , H03H2003/025 , H03H2003/028 , Y10T29/42
Abstract: This disclosure provides implementations of methods, apparatus and systems for producing acoustic wave devices and for selectively modifying one or more acoustic or electromechanical characteristics of such devices. In one aspect, a method includes depositing a structural layer over a substrate. The structural layer includes a plurality of structural portions, each being positioned over a corresponding device region. The method also includes arranging a mask layer over the structural layer. The mask layer includes a plurality of mask portions, each including a number of mask openings that expose a corresponding region of the structural portion. The method also includes accelerating dopant particles toward the mask layer. The accelerated dopant particles that proceed through the mask openings are impacted into the corresponding structural portion. The impacted dopant particles modify material properties in the structural portion, which then effect a change in the acoustic or electromechanical characteristics of the acoustic wave device.
Abstract translation: 本公开提供了用于产生声波装置并用于选择性地修改这种装置的一个或多个声学或机电特性的方法，装置和系统的实现。 一方面，一种方法包括在衬底上沉积结构层。 结构层包括多个结构部分，每个结构部分位于相应的装置区域上。 该方法还包括在结构层上布置掩模层。 掩模层包括多个掩模部分，每个掩模部分包括暴露结构部分的对应区域的多个掩模开口。 该方法还包括向掩模层加速掺杂剂颗粒。 进入掩模开口的加速掺杂剂颗粒被冲击到相应的结构部分。 受影响的掺杂剂颗粒改变结构部分中的材料性质，其然后影响声波装置的声学或机电特性的变化。
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