Invention Grant
US09165797B2 Liquid processing apparatus, liquid processing method, and storage medium
有权
液体处理装置,液体处理方法和存储介质
- Patent Title: Liquid processing apparatus, liquid processing method, and storage medium
- Patent Title (中): 液体处理装置,液体处理方法和存储介质
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Application No.: US13746476Application Date: 2013-01-22
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Publication No.: US09165797B2Publication Date: 2015-10-20
- Inventor: Kousuke Yoshihara , Yuichi Yoshida , Soichiro Okada
- Applicant: Tokyo Electon Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2012-013136 20120125
- Main IPC: B05C13/02
- IPC: B05C13/02 ; B05C11/10 ; H01L21/67 ; H01L21/02 ; G03F7/16

Abstract:
A solvent such as PGMEA is coated on a wafer in advance to easily spread resist liquid onto the wafer on a spin chuck. Before coating, the solvent supplied from a solvent supply source is stored in a distill tank first, the solvent is heated by a heating unit to be evaporated, and the evaporated solvent is cooled by a cooler, thereby performing the purification of the solvent by distillation. Therefore, particles among the solvent are removed. The purified solvent is stored in a storage tank first, and then supplied to a solvent nozzle above the spin chuck from a solvent supplying line. And then, the solvent is coated on the wafer by ejecting the solvent from the solvent nozzle to the wafer. Further, the distill tank is cleaned periodically to suppress the increase of the concentration of the particles in the solvent.
Public/Granted literature
- US20130189852A1 LIQUID PROCESSING APPARATUS, LIQUID PROCESSING METHOD, AND STORAGE MEDIUM Public/Granted day:2013-07-25
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