Invention Grant
- Patent Title: Optical printed circuit board, apparatus and method for manufacturing same
- Patent Title (中): 光学印刷电路板,其制造方法
-
Application No.: US13584762Application Date: 2012-08-13
-
Publication No.: US09170370B2Publication Date: 2015-10-27
- Inventor: Bing-Heng Lee
- Applicant: Bing-Heng Lee
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW101107006A 20120302
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/42 ; G02B6/43

Abstract:
An optical printed circuit board includes a substrate, a first cladding layer, a core layer, and a second cladding layer. The first cladding layer is formed on the substrate and defines a receiving groove. The core layer is received in the receiving groove. The second cladding layer is formed on the core layer. The refractive index of the core layer is greater than that of the first cladding layer and that of the second cladding layer. The core layer includes a bottom surface, a first refractive surface, and a second refractive surface. An included angle between the bottom surface and the first refractive surface is about 135 degrees. An included angle between the bottom surface and the second refractive surface is about 135 degrees.
Public/Granted literature
- US20130230277A1 OPTICAL PRINTED CIRCUIT BOARD, APPARATUS AND METHOD FOR MANUFACTURING SAME Public/Granted day:2013-09-05
Information query