公开(公告)号：US08873902B2

公开(公告)日：2014-10-28

申请号：US13600225

申请日：2012-08-31

Applicant: Bing-Heng Lee

Inventor： Bing-Heng Lee

IPC: G02B6/00 ,  G02B6/36

CPC classification number: G02B6/4214 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/428

Abstract: An optical transmission module includes a printed circuit board (PCB) including a first surface and an opposite second surface, a ceramic substrate mounted on the first surface, a light emitting diode and a photodiode carried on the ceramic substrate, an optical printed circuit board (OPCB) mounted on the second surface, a first reflective unit and, and a second reflective unit. The OPCB includes a flexible substrate which carries a first planar optical wave guide corresponding the first reflective unit and a second planar optical wave guide corresponding the second reflective unit. The PCB defines a first through hole aligned with the light emitting diode and the first reflective unit and a second through hole aligned with the photodiode and the second reflective unit.

Abstract translation: 光传输模块包括：印刷电路板（PCB），包括第一表面和相对的第二表面;安装在第一表面上的陶瓷基板，发光二极管和陶瓷基板上携带的光电二极管，光学印刷电路板 OPCB），第一反射单元和第二反射单元。 OPCB包括柔性基板，其承载对应于第一反射单元的第一平面光波导和对应于第二反射单元的第二平面光波导。 PCB限定了与发光二极管和第一反射单元对准的第一通孔和与光电二极管和第二反射单元对准的第二通孔。

公开(公告)号：US08831434B2

公开(公告)日：2014-09-09

申请号：US13531386

申请日：2012-06-22

Applicant: Bing-Heng Lee

Inventor： Bing-Heng Lee

IPC: H04B10/00

CPC classification number: H04B10/801

Abstract: A computer data transmission system includes a CPU, a photoelectrical conversion module electrically connected to the CPU, a plurality of I/O interface cards, and a plurality of first optical fibers. The photoelectrical conversion module includes a plurality of photoelectrical conversion units. Each I/O interface card includes at least one photoelectrical conversion unit for converting electrical signals to optical signals or converting optical signals to electrical signals. The first optical fibers connect the photoelectrical conversion units of the I/O interface cards and the photoelectrical conversion units of the photoelectrical conversion module. The photoelectrical conversion unit of the photoelectrical conversion module receives electrical signals outputted by the CPU, and convert the electrical signals to optical signals. The converted optical signals are transmitted to the photoelectrical conversion unit of the I/O interface card, and the photoelectrical conversion unit of the I/O interface card converts the optical signals to electrical signals.

Abstract translation: 计算机数据传输系统包括CPU，电连接到CPU的光电转换模块，多个I / O接口卡和多个第一光纤。 光电转换模块包括多个光电转换单元。 每个I / O接口卡包括至少一个光电转换单元，用于将电信号转换成光信号或将光信号转换成电信号。 第一根光纤连接I / O接口卡的光电转换单元和光电转换模块的光电转换单元。 光电转换模块的光电转换单元接收由CPU输出的电信号，并将电信号转换为光信号。 转换的光信号被传送到I / O接口卡的光电转换单元，I / O接口卡的光电转换单元将光信号转换成电信号。

公开(公告)号：US08750658B2

公开(公告)日：2014-06-10

申请号：US13458407

申请日：2012-04-27

Applicant: Bing-Heng Lee

Inventor： Bing-Heng Lee

IPC: G02B6/42

CPC classification number: G02B6/4206 ,  B29D11/00663 ,  G02B6/1221 ,  G02B6/4214 ,  G02B6/43

Abstract: An optical coupling module includes a substrate, a circuit board defining two through holes, an optical waveguide positioned between the substrate and the circuit board, and an optical assembly. The optical waveguide includes a core and a clad, each core comprises two coupling surfaces corresponding to the two through holes. At least one coupling surfaces is in an arcuate shape. The clad covers the core, except for the two coupling surfaces exposing out of the clad. The optical assembly formed on the circuit board comprises an optical emitting element and an optical receiving element. The optical emitting element and the optical receiving element are positioned above the two through holes, respectively. Light emitted from the optical emitting element enters the optical waveguide via one of the coupling surface, and leaves from another coupling surface to reach the optical receiving element. The coupling surface is capability of focusing light.

Abstract translation: 光耦合模块包括基板，限定两个通孔的电路板，位于基板和电路板之间的光波导和光学组件。 光波导包括芯和包层，每个芯包括对应于两个通孔的两个耦合表面。 至少一个联接表面是弧形的。 除了从包层外露出的两个耦合表面外，包层覆盖芯。 形成在电路板上的光学组件包括光发射元件和光接收元件。 光发射元件和光接收元件分别位于两个通孔的上方。 从光发射元件射出的光通过耦合面中的一个进入光波导，从另一耦合面离开到达光接收元件。 耦合面是聚光的能力。

公开(公告)号：US09170370B2

公开(公告)日：2015-10-27

申请号：US13584762

申请日：2012-08-13

Applicant: Bing-Heng Lee

Inventor： Bing-Heng Lee

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/43

CPC classification number: G02B6/12002 ,  G02B6/4214 ,  G02B6/43

Abstract: An optical printed circuit board includes a substrate, a first cladding layer, a core layer, and a second cladding layer. The first cladding layer is formed on the substrate and defines a receiving groove. The core layer is received in the receiving groove. The second cladding layer is formed on the core layer. The refractive index of the core layer is greater than that of the first cladding layer and that of the second cladding layer. The core layer includes a bottom surface, a first refractive surface, and a second refractive surface. An included angle between the bottom surface and the first refractive surface is about 135 degrees. An included angle between the bottom surface and the second refractive surface is about 135 degrees.

Abstract translation: 光学印刷电路板包括基板，第一包层，芯层和第二包覆层。 第一覆层形成在基板上并限定接收槽。 芯层容纳在接收槽中。 第二覆层形成在芯层上。 芯层的折射率大于第一包层和第二包层的折射率。 芯层包括底表面，第一折射表面和第二折射表面。 底表面和第一折射表面之间的夹角为约135度。 底表面和第二折射表面之间的夹角为约135度。

公开(公告)号：US08729696B2

公开(公告)日：2014-05-20

申请号：US13534192

申请日：2012-06-27

Applicant: Bing-Heng Lee ,  Kuo-Fong Tseng

Inventor： Bing-Heng Lee ,  Kuo-Fong Tseng

IPC: H01L23/12 ,  G01R31/02 ,  G01R31/00 ,  G06F19/00

CPC classification number: G01R31/2635 ,  H01S5/0014

Abstract: In a testing method for an LD, an LD die is held. Then, electric current increasing with a fixed increment and having a sequence of current values is supplied to the LD die to drive the LD die to emit light and a sequence of voltage values across the LD die and corresponding to the sequence of current values, respectively, is metered. A sequence of power values corresponding to the sequence of current values, respectively, is also metered. Next, an electro-optical property of the LD die is determined according to the sequence of current values, the sequence of voltage values, and the sequence of power values. Finally, if the LD die is determined to be qualified based upon the electro-optical property of the LD die, the LD die is packaged into the LD.

Abstract translation: 在LD的测试方法中，保持LD模具。 然后，将具有固定增量并且具有电流值序列的电流提供给LD管芯，以驱动LD管芯分别在LD管芯上发射光和一系列电压值，并分别对应于电流值序列 ，计量。 还计算与当前值序列对应的功率值序列。 接下来，根据电流值的顺序，电压值的顺序和功率值的顺序来确定LD管芯的电光特性。 最后，如果LD芯片根据LD裸片的电光特性被确定为合格，LD芯片封装在LD中。