Invention Grant
- Patent Title: Method and apparatus for irradiating a semi-conductor wafer with ultraviolet light
- Patent Title (中): 用紫外线照射半导体晶片的方法和装置
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Application No.: US14217715Application Date: 2014-03-18
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Publication No.: US09171747B2Publication Date: 2015-10-27
- Inventor: James V. Bachman , James M. Borsuk , James Khoury , Edward C. McGhee
- Applicant: Nordson Corporation
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: Wood, Herron & Evans, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; H01J65/04

Abstract:
An apparatus for generating ultraviolet light and irradiating a 450 mm diameter semi-conductor wafer. The apparatus includes a plenum and an array of nine RF irradiator units coupled with the plenum. Each irradiator unit includes a plasma lamp bulb and an RF generator operable to generate a radiation energy field to excite the plasma lamp bulb and emit the ultraviolet light. The nine irradiator units are arranged in three rows with three of the irradiator units in each row.
Public/Granted literature
- US20140306603A1 METHOD AND APPARATUS FOR IRRADIATING A SEMI-CONDUCTOR WAFER WITH ULTRAVIOLET LIGHT Public/Granted day:2014-10-16
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