Invention Grant
US09171777B2 Semiconductor device and method for manufacturing a semiconductor device 有权
半导体装置及其制造方法

Semiconductor device and method for manufacturing a semiconductor device
Abstract:
A semiconductor device includes a semiconductor substrate including a main surface with a polygonal geometry and a main electric circuit manufactured within a main region on the semiconductor substrate. The main electric circuit is operable to perform an electric main function. The main region extends over the main surface of the semiconductor substrate leaving open at least one corner area at a corner of the polygonal geometry of the main surface of the semiconductor substrate. The corner area extends at least 300 μm along the edges of the semiconductor substrate beginning at the corner.
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